A senior executive at a major IoT connectivity platform recently summarised his company's manufacturing strategy: "Oh yeah, we're just manufacturing a SIM into the device with a global bootstrap." He said it the way you describe a solved problem. Everyone on the call nodded. And that reaction is exactly the issue. What he described is not In-Factory Profile Provisioning. It is not even close. But his understanding reflects where the vast majority of the industry stands today: conflating the act of soldering an eUICC onto a circuit board with a preloaded bootstrap profile with IFPP, an architecturally distinct manufacturing process that changes where, when, and how operational connectivity is embedded into a device. The full article explores the structural difference between bootstrap-based provisioning and true IFPP, why the confusion persists, and three diagnostic questions every enterprise should ask before accepting an IFPP claim from their connectivity partner. Read the full article on IoT Business News →